Manufacturing Process Background

Manufacturing Process 制造工艺

HICHIP has accumulated certain resource advantages and processing experience, and has integrated strategic partners such as core technology designers, packaging and testing manufacturers. Product lines include USB, SSD, etc. Support high-stack packaging, high packaging and testing yield, and moderate cost. 海芯积累了一定的资源优势和加工经验,整合了核心技术设计商、封装测试厂等战略合作伙伴。产品线包括USB、SSD等。支持高堆叠封装、高封装测试良率、成本适中。

High Performance

High Performance 高性能

High Security

High security 高安全性

Flexible Expansion

Flexible expansion 灵活扩展

USB

USB Flash Chips USB Device

SSD

SSD Circuit Board SSD Module

Manufacturing Process 制造工艺

Inked Wafer

Inked Wafer

Inked die Transfer

Inked die Transfer

Die Sorting

Die Sorting

Packaging

Packaging

Flash IC F/W

Flash IC F/W

P/N Marking

P/N Marking

SMT

SMT

Flash Card Tester

Flash Card Tester

Module

Module

CrystalDiskMark 7.0.0 x64 [ADMIN]

D: 0% (0/119GiB)
Test
Read [MB/s]
Write [MB/s]
SEQ1M Q8T1
456.33
516.55
SEQ1M Q1T1
456.33
501.23
RND4K Q32T16
140.28
330.72
RND4K Q1T1
44.99
113.00
128GB SSD

CrystalDiskMark 7.0.0 x64 [ADMIN]

D: 0% (0/238GiB)
Test
Read [MB/s]
Write [MB/s]
SEQ1M Q8T1
548.01
524.60
SEQ1M Q1T1
538.38
508.92
RND4K Q32T16
305.18
336.86
RND4K Q1T1
50.97
113.55
256GB SSD